Development of a Simple Dielectric Analysis Module for Online Cure Monitoring of a Commercial Epoxy Resin Formulation

Therefore, closely monitoring this process is necessary to assure the manufacturing quality and productivity. In this way, the aim of this study is to develop a simple dielectric module for monitoring and optimizing the industrial curing cycle of thermosets.

The module is based on a data acquisition system and an interdigital sensor that remains in contact with the resin throughout the entire curing process. Dielectric analysis (DEA) was performed in a commercial epoxy resin formulation widely used as a matrix for thermoset composites, which was submitted to a pre-established and validated curing cycle. The properties derived from DEA measurements are in accordance with differential scanning calorimetry (DSC) results, allowing the identification of key stages of the curing process.