Failure Analysis Data of Gold-Aluminum Bonding for Aerospace ASIC LMD2021

It contains 10 documents and 2 SEM microscopy subdirectories (5 microscopy samples in total), organized around a complete evidence chain of “QA-test failure → DT trouble-shooting → thermal design & temperature reconstruction → process re-verification & comparison → micro-mechanism”.

Specifically, the V1.1 Technical Analysis Report (6.6 MB) serves as the master report, covering the four-stage test flow on 41 samples, the failure phenomena of units #35/#26, the failure analysis from Guangzhou 5th Institute, the fault-tree analysis, the Arrhenius life-prediction model, and the optimization proposals for Schemes A/B; the 300°C/24h pull-strength data and the verification-unit bond-strength data provide direct evidence for process re-verification, while the burn-in/test re-inspection results and the data from low-power reference chips (LSD2021C, TRNG2016, etc.) are used to rule out correlations with power dissipation and process; the thermal simulation report (Rjc-bottom = 22.90°C/W) and the thermal-resistance test report V2 (Rj-top = 56.43°C/W) are used for temperature reconstruction, and the FX0426 third-party quality certificate together with the V2040 production-flow records provide batch-quality and traceability support; the SEM images of the F-12 failed samples and the 300°C verification samples furnish first-hand micro-evidence of IMC morphology, Kirkendall voids, and bond-pad cracking.