Metal deposited nanoparticles for lead-free solder _ original data

This data set was created in the frame of FWF project P34894 - Hybrid solder joins, new promising soldering strategy, Grant DOI 10.55776/P34894 This file contains the original data used to generate the figures presented in the manuscript "Metal deposited nanoparticles as “bridge materials” for lead-free solder nanocomposites" doi.org/10.1007/s13204-023-02898-z. Authors: Yuriy Plevachuk, Peter Švec Sr, Peter Švec, Lubomir Orovcik, Otto Bajana, Andriy Yakymovych, Alexander Rud The materials are provided to ensure transparency, reproducibility, and ease of re‑analysis.

Publication und dataset are released under the CC BY 4.0 license. Contents: TiFF images of High‑resolution microscopy (SEM and TEM) and other imaging data used as the basis for figures and charts. files/ Images are named according to sample identifiers to allow straightforward matching between raw data and figure components. Date of generation is included in respective images.